讲座地点：腾讯会议ID：367 8492 4804 密码2200
主办单位：航空工程学院 国际合作部 研究生处
University of Hertfordshire, UK. Associate Professor（副教授）
PhD (Distinction) Mechanical & Thermal Engineering (Thermofluids), 2004, Beihang University & HongKong University of Science and Technology, China MSc (Distinction) Mechanical & Thermal Engineering(Thermofluids)
（1）Flow and Heat Transfer in Microchannel
Miniaturization of electronic devices has led to advances in various engineering fields, including space technology, defense systems, aerospace applications, manufacturing technology, industrial processes and consumer electronics. Heat dissipation in the electronic components, however, is being a critical issue due to the faster increase in the components’ heat flux and increasing demand for the miniature in features’ size. The heat flux of the electronic chips may exceed 400 W/cm2 in order to meet the demand for high performance electronic components. Since overheating of the electronic components degrades the components’ performance, reliability and even cause failure of the components, high performance cooling techniques are required to keep device temperatures low for acceptable performance and reliability. The microchannel heat sink (MCHS) is a concept well suited for many electronic applications because of its ability to remove a large amount of heat from a small area.
（2）3D Modelling and Simulation of Ice Accretion Process on Aircraft Wings
Aircraft icing has long been recognized for over sixty years and continues to be an important flight safety issue in the aerospace community. Ice accretion on an aircraft wing occurs when supercooled water droplets in the atmosphere impact on the surface of aircraft’s wings. The formation of ice on an aircraft wing results in a sharp increase in drag and a reduction in maximum lift. Furthermore, ice accretion on aircraft wings also leads to a reduction in stall angle and increment in moment coefficient of the wing. This causes a deterioration in the aerodynamic performance of the aircraft. Although many significant results in numerical models of ice accretion have been already obtained by now, the comprehension of the ice accretion mechanism on aircraft wing is still quite limited, especially for the cases of 3D, and there is still much room for improvement.
（3）Performance Analysis of a Loop Heat Pipe Integrated with Thermoelectric Cooler Under Acceleration Field
Loop heat pipe (LHP) is a high efficient and reliable two-phase heat transfer device, which utilizes the vapor-liquid phase change of working liquid in evaporator and condenser. Compared with traditional heat pipe, LHP possess the advantages of long-distance heat transfer capability, flexible installation, precise temperature control and anti-overload acceleration. Over the past three decades, LHPs have been widely applied in various aircraft, spacecraft and electronic cooling equipment. Different from conventional LHP, the dual compensation chamber loop heat pipe (DCCLHP) has two compensation chambers (CCs) distributed at both ends of the evaporator, which enables the capillary core to be more effectively infiltrated under gravity field or acceleration field. Some previous researches have proven that DCCLHP could work successfully under some extreme conditions such as anti-gravity or subjected to acceleration forces.